Power Module Packaging Market Size to Grow USD 5.29 Billion by 2032; Surging Demand for efficient Solutions in EVs Boost Market Expansion | SNS Insider
The power module packaging market in the U.S. was worth USD 0.45 billion in 2024 and is expected to increase at a compound annual growth rate (CAGR) of 10.30% from 2025 to 2032, reaching USD 0.99 billion.
Austin, Oct. 20, 2025 (GLOBE NEWSWIRE) — Power Module Packaging Market Size & Growth Insights:
According to the SNS Insider,“The Power Module Packaging Market size was valued at USD 2.53 Billion in 2024 and is projected to reach USD 5.29 Billion by 2032, growing at a CAGR of 9.66% during 2025-2032.”
Increasing Power Requirements Boost the Demand for Power Module Packaging Globally
Due to the growing power requirements require enhanced thermal management and smaller size, there is a great demand for highly efficient and compact power modules due to the growing use of electric vehicles and renewable energy systems. In order to increase performance and dependability, manufacturers are concentrating on cutting-edge packaging solutions and utilizing wide-bandgap materials, such as silicon carbide and gallium nitride. Growing energy and power demands spur innovation in packaging technology, which in turn encourages shrinking, improved heat dissipation, and increased system efficiency. This cause-and-effect dynamic supports market expansion in the high-performance computing, automotive, and industrial sectors.
Get a Sample Report of Power Module Packaging Market Forecast @ https://www.snsinsider.com/sample-request/8321
Leading Market Players with their Product Listed in this Report are:
- Analog Devices
- Nexperia
- Infineon Technologies
- Broadcom
- Vishay Intertechnology
- ON Semiconductor
- Samsung Electronics
- Mitsubishi Electric
- Microchip Technology
- STMicroelectronics
- Hitachi
- Texas Instruments
- Fuji Electric
- Renesas Electronics
- Toshiba
- Amkor Technology
- Kyocera
- Semikron
- ROHM Semiconductor
- Maxim Integrated
Power Module Packaging Market Report Scope:
| Report Attributes | Details |
| Market Size in 2024 | USD 2.53 Billion |
| Market Size by 2032 | USD 5.29 Billion |
| CAGR | CAGR of 9.66% From 2025 to 2032 |
| Report Scope & Coverage | Market Size, Segments Analysis, Competitive Landscape, Regional Analysis, DROC & SWOT Analysis, Forecast Outlook |
| Key Segmentation | • By Type(Integrated Power Modules, Discrete Power Modules and Hybrid Power Modules) • By Material(Silicon, Silicon Carbide and Gallium Nitride) • By Power Rating(Low Power, Medium Power and High Power) • By Application(Renewable Energy Systems, Electric Vehicles, Consumer Electronics and Industrial Automation) |
Purchase Single User PDF of Power Module Packaging Market Report (20% Discount) @ https://www.snsinsider.com/checkout/8321
Key Industry Segmentation
By Type
Integrated Power Modules led the market with a share of 47%, reflecting their widespread adoption across automotive, industrial, and high-performance applications. Hybrid Power Modules are experiencing the fastest growth at a CAGR of 12.17%, driven by rising demand for compact, high-efficiency solutions and increasing integration of advanced materials and innovative packaging technologies.
By Material
Silicon dominates the Power Module Packaging market with a share of 67%, reflecting its widespread use across automotive, industrial, and consumer electronics applications. Gallium nitride is experiencing the fastest growth at a CAGR of 12.24%, driven by rising demand for high-efficiency, high-density, and compact power modules and increasing adoption of advanced wide-bandgap materials and innovative packaging technologies.
By Power Rating
Medium power modules lead the Power Module Packaging market holding a share of 39%, reflecting their extensive use across automotive, industrial, and consumer electronics applications. High power modules are registering the fastest growth at a CAGR of 11.38%, driven by increasing demand for higher output, efficient thermal management, and compact designs in electric vehicles, renewable energy systems, and high-performance computing.
By Application
Consumer electronics lead the Power Module Packaging market holding a share of around 29%, reflecting their widespread use in compact, high-performance devices. Renewable energy systems are growing the fastest with a CAGR of 12.47%, driven by increasing demand for efficient, high-density power modules in solar, wind, and other clean energy applications.
Regional Insights:
In 2024, Asia Pacific dominated the Power Module Packaging Market and accounted for 44% of revenue share, driven by rapid industrialization, growing adoption of electric vehicles, and expanding renewable energy infrastructure.
North America is expected to witness the fastest growth in the Power Module Packaging Market over 2025-2032, with a projected CAGR of 11.37%, This growth is driven by increasing adoption of electric vehicles, expansion of renewable energy projects, and rising demand for high-efficiency power modules in industrial and high-performance computing applications.
Do you have any specific queries or need any customized research on Power Module Packaging Market? Submit your inquiry here @ https://www.snsinsider.com/enquiry/8321
Recent News:
- In June 2024, STMicroelectronics announced a new high-volume 200mm silicon carbide manufacturing campus in Catania, Italy, integrating wafer fabrication, device production, and module packaging to support automotive, industrial, and cloud infrastructure applications and expand global SiC capacity.
- In January 2024, Mitsubishi Electric announced six new J3-Series SiC and Si power modules for xEV inverters, featuring compact, high-efficiency designs that reduce power loss, support inverter downsizing, and enhance reliability for electric and plug-in hybrid vehicles, with samples available from March 25 and global exhibition showcases planned.
Exclusive Sections of the Power Module Packaging Market Report (The USPs):
- THERMAL PERFORMANCE METRICS – helps you evaluate percentage improvements in thermal resistance, power density, and reliability achieved through advanced module packaging technologies.
- TECHNOLOGY ADOPTION RATE – helps you track the integration of wide bandgap materials such as SiC and GaN, growth in 3D and double-sided cooling designs, and miniaturization trends in EV and industrial power electronics.
- COST & ROI ANALYSIS – helps you understand system-level cost reductions, payback periods for high-performance packaging adoption, and the strategic balance between cost-optimized and performance-focused solutions.
- RELIABILITY & LIFECYCLE BENCHMARKS – helps you assess average module lifespan, failure rate reductions enabled by improved thermal management, and compliance with accelerated stress-testing standards.
- ADVANCED PACKAGING INNOVATION INDEX – helps you identify leading advancements in material science, thermal architecture, and structural design that enhance efficiency and extend module durability across applications.
About Us:
SNS Insider is one of the leading market research and consulting agencies that dominates the market research industry globally. Our company’s aim is to give clients the knowledge they require in order to function in changing circumstances. In order to give you current, accurate market data, consumer insights, and opinions so that you can make decisions with confidence, we employ a variety of techniques, including surveys, video talks, and focus groups around the world.
CONTACT: Contact Us: Rohan Jadhav - Principal Consultant Phone: +1-315 636 4242 (US) | +44- 20 3290 5010 (UK)
Disclaimer: The above press release comes to you under an arrangement with GlobeNewswire. DailyIndiaNews.com takes no editorial responsibility for the same.
